Thermal Management of Mobile Devices via PCM
Year: 2025
Type: article
Abstract: This study investigates the effectiveness of Phase Change Material (PCM)-based thermal management in portable electronic devices, particularly focusing on n-eicosane as a heat storage medium. The research examines the ability of a Heat Storage Unit (HSU) containing PCM to regulate chip temperatures in mobile devices such as Personal Digital Assistants (PDAs) and wearable computers. Experimental tests assess the impact of heat dissipation rates and the orientation of the HSU on temperature distribution. Findings reveal that PCM effectively absorbs excess heat during transient operation, maintaining chip temperatures below the critical threshold of 50° C for extended periods. However, high power dissipation can still lead to overheating, highlighting the importance of optimized heat source placement and PCM volume. The results underscore the potential of PCM-based passive cooling solutions for enhancing thermal performance in compact electronic systems. Major Findings: This study confirms that PCM-based thermal management effectively regulates chip temperatures in mobile devices, keeping them below 50°C during transient operation. However, the placement of heat sources and the volume of PCM play crucial roles in temperature distribution, as improper configurations can lead to localized overheating. While PCM enhances thermal stability, high power dissipation can still cause temperature spikes, necessitating additional design optimizations for improved performance.
Institutions: Dnyaan Prasad Global University, Vishwakarma University
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W4410319239