Work

An Innovative Strategy for Achieving Interface Gradient Material Using Co-Deposition Technology

Year: 2025

Type: article

Abstract: In this study, high-performance SiC whisker (SiCw)-reinforced Cu matrix functionally graded materials (FGMs) were achieved through the synergy of numerical simulation and co-electrodeposition and then successfully applied as the interface of Cu and Si. A comprehensive numerical simulation framework was developed to investigate the influence of gradient transition modes and the maximum volume fraction of SiCw on the thermal–mechanical properties in the different gradient structures. The optimized FGMs via numerical simulation were fabricated using a co-electrodeposition technique, producing a 100 μm thick coating with a SiCw volume fraction gradient ranging from 0% to 40%. The interface of Cu and SiC was void free in the FGMs and the SiCw was coated by nano-scale Cu grains during the electroplating process. The coefficient of thermal expansion in FGMs was higher than 9.78 × 10−6 K−1, which was the coefficient of thermal expansion in the Cu-40% vol. SiCw, and lower than 16.4 × 10−6 K−1, which was the coefficient of thermal expansion in pure Cu. Notably, the bonding interface area between the Cu/Si joint with the gradient-structured FGMs was more than twice that of non-graded materials. The enhanced thermal–mechanical performance was attributed to the synergistic effects of the nano-scale grain-reinforced SiCw-Cu interface and an optimized stress distribution achieved by the gradient structure.

Source: Nanomaterials

DOI: 10.3390/nano15100718

Authors: Yanxin Zhang, Liyan Lai, Yan Luo, Zhuoqing Yang, Guifu Ding

Institutions: Shanghai Jiao Tong University, Shanghai Institute of Technology

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $2,896

Funder: National Natural Science Foundation of China