Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing
Year: 2025
Type: article
Abstract: The demand for tactile sensors in robotics, virtual reality, and health care highlights the need for high performance and customizability. Despite advances in vision-based technologies, tactile sensing remains crucial for precise interaction and subtle pressure detection. In this work, we present a design and fabrication method of customizable tactile sensors based on thermoformed three-dimensional electronics. This approach enables ultrawide modulus tunability (10 pascals to 1 megapascal) and superior mechanical properties, including negligible hysteresis and high creep resistance. These features allow the sensor to detect a broad spectrum of pressures, from acoustic waves to body weight, with high performance. The proposed sensors have high sensitivity (up to 5884 per kilopascal), high linearity ( R 2 = 0.999), low hysteresis (<0.5%), and fast response (0.1 milliseconds). We demonstrate applications in human-computer interaction and health care, showcasing their potential in various fields. This platform provides a scalable solution for fabricating versatile, high-performance tactile sensors.
Source: Science Advances
Authors: Jungrak Choi, Chankyu Han, Donho Lee, Hyunjin Kim, Gihun Lee, Ji-Hwan Ha, Yongrok Jeong, Junseong Ahn, Hyunkyu Park, Hyeonseok Han, Seokjoo Cho, Jimin Gu, Inkyu Park
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $4,500
OpenAlex ID: W4410358197