Work

A High Efficiency Hybrid Modular Multilevel Converter With a SiC Device-Based External Shaping Module

Year: 2025

Type: article

Source: IEEE Transactions on Power Electronics

DOI: 10.1109/tpel.2025.3570345

Authors: Peng Ren, Qi Guo, Yuchao Hou, Chunming Tu, Donghai Zhu, Kai Sun, Lei Wang, Fan Xiao

Institutions: Hunan University, Tsinghua Shenzhen International Graduate School, Tsinghua University, State Key Laboratory of Advanced Electromagnetic Engineering and Technology, Huazhong University of Science and Technology

Language: English

Topic: HVDC Systems and Fault Protection

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G979175202

OpenAlex ID: W4410358769

FWCI: 0.904

Cites: 33

Cited by: 4

Related to: 10