Work

HMC Method for Defect Classification and Location of Postbond TSVs

Year: 2025

Type: article

Source: IEEE Transactions on Instrumentation and Measurement

DOI: 10.1109/tim.2025.3569929

Authors: Changle Zhi, Gang Dong, Deguang Yang, Daihang Liu, Zhangming Zhu

Institution: Xidian University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Awards: G1981401797, G2320218852, G8921095769

OpenAlex ID: W4410359284

FWCI: 0.225

Cites: 48

Cited by: 1

Related to: 10