Work

Electromigration in Gold: Challenges and Possibilities (Invited)

Year: 2025

Type: conference-paper

Source: IEEE International Reliability Physics Symposium proceedings

DOI: 10.1109/irps48204.2025.10983786

Author: Hajdin Ceric

Institution: TU Wien

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410394259

FWCI:

Cites: 24

Cited by:

Related to: 10