Effect of TSV – Keep Out Zone on BEOL Reliability of HBM3E
Year: 2025
Type: conference-paper
Authors: Danee Cho, Jin-seok Kim, Taejoong Kim, Seung-Kwon Noh, Junho Song, Junsung Kim, Seungchan An, Yonghui Eum
Institution: SK Hynix (South Korea)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4410394342