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Advanced RTN Analysis on 3D NAND Trench Devices Using Physics-Informed Machine Learning Framework

Year: 2025

Type: conference-paper

Source: IEEE International Reliability Physics Symposium proceedings

DOI: 10.1109/irps48204.2025.10983878

Authors: Y. Higashi, A. Varanasi, P. J. Roussel, P. S. Canflanca, J. P. Bastos, A. Grill, E. Catapano, R. Asanovski, J. Franco, B. Kaczer, A. Chasin, D. Verreck, S. Ramesh, L. Breuil, A. Arreghini, S. Rachidi, Y. Jeong, G. Van den Bosch, M. Rosmeulen, R. Degraeve

Institution: IMEC

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410394382

FWCI: 4.641

Cites: 16

Cited by: 2

Related to: 10