New Burnout Failure at the Chip Edge: Analysis and Preventive Design by a Novel Experimental Approach
Year: 2025
Type: conference-paper
Authors: Seungmin Lee, Taegon Lee, Gaeun Kim, Kwang-Ryul Lee, Eunji An, Sekwon Hong, Sungjun Kim, Soonkwan Kang, Seokwoo Hong, Hwan Cha, Minkyu Kang, Jaesun Yun, Moongeun Kim, Woongseop Lee, Joonsung Lim, Joonyoung Oh, Kyungyoon Noh, Seungwan Hong, Sung-Hoi Hur
Institutions: Samsung (South Korea), Samsung Electronics (South Korea)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4410394668