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Novel Stress Migration Failure Analysis by EBSD-KAM

Year: 2025

Type: conference-paper

Source: IEEE International Reliability Physics Symposium proceedings

DOI: 10.1109/irps48204.2025.10982797

Authors: Chih-Feng Ku, Yu-Lin Li, Yu-Chiao Lin, C.K. Kao, Ting-Ying Shih, Huei-Wen Yang

Institution: Taiwan Semiconductor Manufacturing Company (Taiwan)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410395183

FWCI:

Cites: 7

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Related to: 10