A Comprehensive Reliability Approach to Heterogeneous Integration in Power Packaging (Invited)
Year: 2025
Type: conference-paper
Authors: R. Villa, A. Mancaleoni
Institution: STMicroelectronics (Italy)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4410395359