Work

A Simplified Method for Analyzing PCB Warpage During Reflow: Focusing on Warpage Change and Initial Warpage Shape

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3570867

Authors: Zhenyang Lei, Jinyong Li, Dayuan Wan, Chunmin Cheng, Daowei Wu, Wei Shen, Kang Liang, Sheng Liu

Institutions: Wuhan University, Southern University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Open Fund of Key Laboratory of Sediment Research, National Key Research and Development Program of China

Awards: G38943770, G6538419727, G7277383210

OpenAlex ID: W4410428295

FWCI: 1.808

Cites: 18

Cited by: 8

Related to: 10