A Comparison between WIPD and PCB Flip-Chip Packaging for Broadband MFCW Agile Radar in Vital-Sign Detection Applications
Year: 2025
Type: conference-paper
Authors: Tian-Wei Huang, Po-Ju Chen, Ti-Yu Chao, Yi-Hsien Lin, Shih-Chun Yeh, Jian-Ming Lin
Institution: National Taiwan University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4410429085
