Work

UCle-Compliant Chiplet Interconnect Design Leveraging Cutting-Edge Packaging Technologies

Year: 2025

Type: conference-paper

Source: IEEE Custom Integrated Circuits Conference (CICC)

DOI: 10.1109/cicc63670.2025.10983497

Authors: Yu-Jie Huang, Mu-Shan Lin, Chien-Chun Tsai, Wei-Chih Chen, Hsin-Hung Kuo, Shu-Chun Yang, Shenggao Li

Institutions: Taiwan Semiconductor Manufacturing Company (China), Taiwan Semiconductor Manufacturing Company (Taiwan)

Language: English

Topic: Interconnection Networks and Systems

Subfield: Computer Networks and Communications

Field: Computer Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410492689

FWCI: 3.994

Cites: 16

Cited by: 3

Related to: 10