Screening of novel slurry additive for improvement of silicon wafer flatness during chemical mechanical polishing
Year: 2025
Type: conference-paper
Abstract: Flatness is an essential feature for evaluating the quality of silicon wafers, which is controlled by multi-step Chemical Mechanical Polishing (CMP) processes. The addition of chemicals in CMP slurry has become a common method to improve the flatness of silicon substrate. However, due to the molecular structure diversity, choosing suitable additives to improve silicon wafer flatness needs trial-and-error experiments, which are cumbersome and time-consuming. To address these limitations, this study introduces a method combining both computational screening and experimental verification, effectively facilitating the selection of additives used in the flatness improvement of silicon wafers. The screening method identified two novel additives, 2,2-Dimorpholinodiethylether (DMDEE) and Trimorpholinophosphine oxide (TMPO). The experimental results show that these two additives can significantly enhance the global and local flatness of silicon substrate while minimizing the reduction in polishing rates. This study not only provides methodological guidance for the development of slurry formulation but also contributes to the mechanism exploration of flatness improvement for silicon CMP.
Authors: Zhipeng Shang, Junli Zhu, Ziwei Lin, Lei Zhu, Weimin Li, Wenjie Yu
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W4410505203