Work

Investigates of Silver Sintered Process by Silver Thin Films and Nanotwinned Silver Thin Films

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

DOI: 10.23919/icep-iaac64884.2025.11003031

Authors: Shin-Yi Huang, Yan-Cheng Liu, Ping-Chun Kao, Yung-Min Hsieh, Yu-Hua Wu, Fan-Yi Ouyang, Tao-Chih Chang

Institutions: Industrial Technology Research Institute, National Tsing Hua University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Tsing Hua University

OpenAlex ID: W4410552852

FWCI: 2.358

Cites: 2

Cited by: 1

Related to: 10