Work

Efforts to Improve the Accuracy of Simulation Technology for Package Substrates by Acquiring Realistic Material Properties

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

DOI: 10.23919/icep-iaac64884.2025.11003013

Authors: Satoshi Nakamura, Aki Tanaka

Institution: Kyocera (Japan)

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410552891

FWCI: 4.717

Cites: 1

Cited by: 2

Related to: 10