Work

Advanced Short Defect Repair Technique for Enhancing Yield in Packaging Architectures

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

DOI: 10.23919/icep-iaac64884.2025.11002993

Authors: Adam Ginsburg, Oded Mor, Guy Levi, Guy Amrani

Institution: KLA (Israel)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410552912

FWCI:

Cites: 1

Cited by:

Related to: 10