Development of Warpage Control Techniques in Multi-Chip Fan-Out System-in Package (SiP) Using Redistribution Layer Technology
Year: 2025
Type: conference-paper
Authors: Jr-Wei Peng, Chih-Cheng Hsiao, Chin-Hung Wang
Institution: Industrial Technology Research Institute
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4410552986