Work

3D Miniaturization of Magnetic-Assisted Capsule Endoscope Using Mass-Transfer Cu Pillar Pin Assembly and Vacuum Printing Encapsulation

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

DOI: 10.23919/icep-iaac64884.2025.11002996

Authors: Li-Cheng Shen, Sing Wu, Ming-Hung Chang, Chao-Hsuan Wang, Tai-Lin Wu, Hung-Yi Tsai, Chung-Ping Chang, Kuan-Ying Shen, Hawk Yeh

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410552995

FWCI:

Cites: 2

Cited by:

Related to: 10