Work

Cu/Diamond Composite Heat Spreader for Thermal Management of Advanced Electronic Devices

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

DOI: 10.23919/icep-iaac64884.2025.11002981

Authors: Masato Sakai, Satoshi Teraji, Tasuku Hamano

Institution: Ishihara Chemical Co., Ltd. (Japan)

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410553085

FWCI:

Cites: 3

Cited by:

Related to: 10