Work

Planar Geometry Solder Joint Study of Alloying Effects on Sn-Bi Electromigration

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

DOI: 10.23919/icep-iaac64884.2025.11003003

Authors: Prabjit Singh, L. Palmer, T. Wassick, R. F. Aspandiar, B. Franco, L.A. Swaminathan, H. Fu, V. Vasudevan, A. Allen, K. Howel, K. Murayama, H. Zhang, A. Lifton, T. Munson, S. Middleton, M. Sarangapani

Institutions: IBM (United States), Intel (United States), Hewlett-Packard (United States), NIHON SUPERIOR CO., LTD. (Japan), Shinko Electric Industries (Japan), Indium Corporation (United States), Foresite (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410583186

FWCI:

Cites: 3

Cited by:

Related to: 10