Work

Interfacial Reactions in Sn/Ag/Cu Sandwiched Structure

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

DOI: 10.23919/icep-iaac64884.2025.11002893

Authors: Yu-Xuan Yang, Chih-Ming Chen

Institution: National Chung Hsing University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410583733

FWCI:

Cites: 4

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Related to: 10