Work

A Mesh Size Searching Method in WLP Reliability Prediction with Fixed Coffin-Manson Parameters

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

DOI: 10.23919/icep-iaac64884.2025.11002887

Authors: Y. T. Su, K. N. Chiang

Institution: National Tsing Hua University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410584010

FWCI: 2.358

Cites: 7

Cited by: 1

Related to: 10