Work

A Machine Learning Model for Vickers Hardness of Sn-In-X Low-Temperature Solder

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

DOI: 10.23919/icep-iaac64884.2025.11002953

Authors: Hao-Wei Kuo, Yu-Chen Liu

Institution: National Cheng Kung University

Language: English

Topic: Machine Learning in Materials Science

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410584047

FWCI: 5.042

Cites: 8

Cited by: 1

Related to: 10