Work

Surface Modification of Cu Native Oxide: Ag Displacement for Homogeneous Layering

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

DOI: 10.23919/icep-iaac64884.2025.11002905

Authors: Shubhayan Mukherjee, Akitsu Shigetou, Shih-kang Lin

Institutions: National Cheng Kung University, National Institute for Materials Science

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410584091

FWCI: 5.113

Cites: 4

Cited by: 1

Related to: 10