Work

Intermetallic Compound Formation and Growth Behavior Between Ruthenium and Tin System

Year: 2025

Type: conference-paper

Source: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

DOI: 10.23919/icep-iaac64884.2025.11002921

Authors: Hsiu-mei Yang, Tzu-hsuan Huang, Yu-hsuan Lin, Min-cian Chen, Shih-kang Lin

Institutions: National Cheng Kung University, Taiwan Semiconductor Manufacturing Company (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410584646

FWCI:

Cites: 7

Cited by:

Related to: 10