Work

Evaluation of ESF3 Split-Gate Cell Cycling Endurance for Eeprom Applications

Year: 2024

Type: conference-paper

Source: IEEE International Integrated Reliability Workshop final report

DOI: 10.1109/iirw62856.2024.11008736

Authors: Steven Lemke, Louisa Schneider, Henry Om'mani, Yuri Tkachev, Parviz Ghazavi, Nhan Do

Institution: Microchip Technology (United States)

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410609358

FWCI: 1.612

Cites: 8

Cited by: 2

Related to: 10