Work

A GaAs Four-Channel TRx Beamformer With Compact Size Based on Stacked-Chip Process

Year: 2025

Type: article

Source: IEEE Microwave and Wireless Technology Letters

DOI: 10.1109/lmwt.2025.3569459

Authors: Lei Wang, Ding Wang, Yu Jian Cheng

Institution: University of Electronic Science and Technology of China

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Defense Pre-Research Foundation of China, National Key Research and Development Program of China

Award: G2943509378

OpenAlex ID: W4410614276

FWCI: 0.231

Cites: 27

Cited by: 1

Related to: 10