Work

Modeling Microstructure Sensitive Degradation of Electroplated Copper During Short Circuit Power Pulsing

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006557

Authors: Alexander Huber, Manuel Petersmann, Thomas Antretter

Institution: Montanuniversität Leoben

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410630733

FWCI:

Cites: 11

Cited by:

Related to: 10