Work

Development and Evaluation of Global-Local Finite Element Models for Solder Joint Reliability under Combined Vibration and Thermal Loads

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006543

Authors: Chengzhe Lyu, Karsten Meier, Karlheinz Bock

Institution: Technische Universität Dresden

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410630735

FWCI: 2.358

Cites: 14

Cited by: 1

Related to: 10