Work

Electromigration Simulation of Copper-Pillar Bump in 3D Integration

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006578

Authors: Zhoubang Du, Leiming Du, GuoQi Zhang

Institution: Delft University of Technology

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410630746

FWCI:

Cites: 8

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Related to: 10