Work

Fatigue Delamination Study of Parylene as Electronic Packaging Material

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006552

Authors: Carlos Rincon-Ruiz, Uwe Zschenderlein, Martin Kühn, Franz Selbmann, Bernhard Wunderle

Institutions: Chemnitz University of Technology, Fraunhofer Institute for Electronic Nano Systems

Language: English

Topic: Mechanical Behavior of Composites

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410630749

FWCI:

Cites: 22

Cited by:

Related to: 10