Work

Direct 3D Numerical Simulation Analysis of Buckled Dielectric Thin Film Packaging Based on Surface Wrinkling between Thin Film Cap and Polymer Ring

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006614

Author: Seonho Seok

Institutions: Université Paris-Saclay, Centre de Nanosciences et de Nanotechnologies

Language: English

Topic: Advanced Materials and Mechanics

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410630826

FWCI:

Cites: 16

Cited by:

Related to: 10