Work

Elastic-Plastic-Creep Model with Damage for SAC Solder Alloys

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006603

Authors: T. Hauck, A. Morozov, Y. Chen, L. Renzi, W. H. Müller

Institutions: Technische Universität Berlin, NXP (United States), Politecnico di Milano

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410630833

FWCI: 2.3

Cites: 12

Cited by: 1

Related to: 10