Work

Mechanical Stresses Induced by Thermal Gradients During Reflow Soldering in Repair and Resuse of Multilayer Ceramic Capacitors (Mlcc): Experiments and Simulation

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006586

Authors: Steffen Wiese, Erik Wiss, Matthias Klauß, David Barth

Institution: Saarland University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410630860

FWCI:

Cites: 25

Cited by:

Related to: 10