Work

Verification of Material Models of an Epoxy Mold Compound Used in Power Module

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006604

Authors: Akshay Vivek Panchwagh, Przemyslaw Jakub Gromala, Sven Rzepka, Bernhard Wunderle

Institutions: Robert Bosch (Germany), Fraunhofer Institute for Electronic Nano Systems, Chemnitz University of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410630878

FWCI: 2.277

Cites: 12

Cited by: 1

Related to: 10