Work

Substrate-Embedded SiC MOSFET Die Attach: A Molecular Dynamics Study on the Physical Properties of Sintered Cu

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006546

Authors: Zhanxing Sun, Fengze Hou, Meiying Su, Xiangan You, Chuan Chen, Rong Fu, Jianyu Feng, Qidong Wang

Institutions: Chinese Academy of Sciences, Institute of Microelectronics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Outstanding Youth Science Fund Project of National Natural Science Foundation of China

Award: G3335991441

OpenAlex ID: W4410630895

FWCI:

Cites: 27

Cited by:

Related to: 10