Work

A Study on the Board-Level Thermomechanical Reliability of Flip-Chip Chip Scale Package (FCCSP)

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006568

Authors: Yi Zhang, Ke Xue, Dong Lu, Kai Chen, Wenzhe Zhao, Xi Zeng, Richeng Liu, Dashun Liu

Institutions: The Hong Kong University of Science and Technology (Guangzhou), Guangzhou HKUST Fok Ying Tung Research Institute

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410630906

FWCI: 2.277

Cites: 9

Cited by: 1

Related to: 10