Work

Reverse Engineering of Thermomechanical Properties for Materials in Microelectronic Packaging

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006598

Authors: Simon Kuttler, Sükrücan Mutlu, Olaf Wittler, Martin Schneider-Ramelow

Institutions: Fraunhofer Institute for Reliability and Microintegration, Technische Universität Berlin

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Bundesministerium für Bildung und Forschung

Award: G7701313305

OpenAlex ID: W4410630939

FWCI:

Cites: 3

Cited by:

Related to: 10