Integrating Cluster Analysis and Artificial Neural Networks to Predict Warpage in Fan-out Panel-Level Packaging
Year: 2025
Type: conference-paper
Authors: M. C. Huang, H.C. Cheng, K. N. Chiang
Institutions: National Tsing Hua University, Feng Chia University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4410630941