Work

Enhanced Analytical Fatigue Model for Sac305 Solder Joints Subjected to Temperature Cycles Considering Geometrical Parameters

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006562

Authors: J-B Libot, P. Milesi

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410631027

FWCI:

Cites: 11

Cited by:

Related to: 10