Work

Thermal Cyclic Fatigue Reliability of Printed Hybrid Electronics (PHE)

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006613

Authors: Prabhat Janamanchi, Swarup Subudhi, Abhijit Dasgupta, Edwin Quinn

Institution: University of Maryland, College Park

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410631085

FWCI:

Cites: 16

Cited by:

Related to: 10