Work

Application of a Drucker-Prager Approach for Reliability Modelling of Inorganic Encapsulation Materials Used for Power Electronic Applications

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006530

Authors: Falk Naumann, Marco Rudolph, Tino Stephan, Marcel Mittag, Michael Bernasch, Sandy Klengel

Institution: Fraunhofer Institute for Microstructure of Materials and Systems

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410638939

FWCI: 2.277

Cites: 6

Cited by: 1

Related to: 10