Work

Finite Element Analysis of Warpage Hysteresis Loop Evolution and Bifurcation in Thinned 4H-SiC Cu_ECD Metalized Wafers

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006612

Authors: Vincenzo Vinciguerra, Giuseppe Luigi Malgioglio, Marco Renna

Institution: STMicroelectronics (Italy)

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410638980

FWCI: 2.809

Cites: 13

Cited by: 1

Related to: 10