Work

Reduced-Order Modelling for Efficient Chip-Package-Board Design

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006531

Authors: Chengdong Yuan, Sönke Maeter, Simon Kuttler, Olaf Wittler, Tamara Bechtold

Institutions: Jade University of Applied Sciences, Fraunhofer Institute for Reliability and Microintegration

Language: English

Topic: Model Reduction and Neural Networks

Subfield: Statistical and Nonlinear Physics

Field: Physics and Astronomy

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410639040

FWCI:

Cites: 18

Cited by:

Related to: 10