Work

Physics-Informed Machine Learning-Based Methodology for Plated Through Holes Lifetime Estimation in Printed Circuit Boards

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006582

Authors: Marco Sperti, Chinmay Nawghane, Bart Vandevelde, Nicolas Lammens, Mathias Verbeke

Institutions: IMEC, Siemens (Belgium), KU Leuven

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: European Commission

Award: G1984120708

OpenAlex ID: W4410639302

FWCI:

Cites: 31

Cited by:

Related to: 10