Work

3D Fine Electrothermal Modeling of IGBT Power Device for Reliability Applications

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006602

Authors: Augustin Empeyrou, Merouane Ouhab, Nicolas Degrenne

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4410639323

FWCI: 4.554

Cites: 19

Cited by: 2

Related to: 10