Work

Bond-Wire Layout Optimization in Power Modules Through Simulation of Electro-Thermo-Mechanical Migration Flux Under Power Cycling

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006542

Authors: Georg Siroky, Slavo Kicin, Lluís Santolaria, Milad Maleki

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410639333

FWCI:

Cites: 30

Cited by:

Related to: 10