Work

Thermomechanical Reliability of Bond Wires in Power Modules Subjected to Power Cycling

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006624

Authors: Mohamed Boutaleb, Fabrice Roqueta, Fabrice Moreau, Yann Brenet, Laurent Barreau

Institution: STMicroelectronics (France)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410639347

FWCI:

Cites: 14

Cited by:

Related to: 10